Rbm Infracon Signs Binding LOI with SUJOK GLOBAL for USD 1 Billion Semiconductor Facility in India
Rbm Infracon Limited has entered into a binding Letter of Intent (LOI)/Memorandum of Understanding (MoU) dated April 18, 2026, with SUJOK GLOBAL Private Limited, a Korean semiconductor technology company. The agreement proposes the establishment of a greenfield advanced semiconductor packaging facility in India, valued at USD 1 billion.The facility is set to specialize in high-volume QFN/LFBGA packaging and advanced Hybrid Bonding technology. This initiative aligns with India's semiconductor mission and national policies aimed at boosting the country's semiconductor ecosystem. The plant is expected to generate significant export-oriented manufacturing capacity in sectors including High Bandwidth Memory (HBM), AI/HPC, chiplets, and advanced image sensors, contributing to the 'Make in India' and 'Atmanirbhar Bharat' initiatives.
Key Deal Parameters
The total project capital expenditure (CAPEX) is approximately USD 1 billion. Under the agreed equity structure, Rbm Infracon will hold a 30% stake, while SUJOK GLOBAL and its financial partners will hold the remaining 70%. This commitment includes a firm Foreign Direct Investment (FDI) of USD 600 million from US capital.The binding LOI/MoU outlines several robust provisions safeguarding the project for both parties. These include technology transfer, irrevocable IP assignment, milestone-based funding commitments, and delay protection mechanisms via equity make-whole provisions. Furthermore, the deal grants strong governance rights to Rbm Infracon, including the right to nominate 50% of the Board with a casting vote, alongside veto rights on key matters.
Details of the agreement structure are as follows:
| Parameter | Detail |
|---|---|
| Parties | Rbm Infracon Limited and SUJOK GLOBAL Private Limited |
| Total Investment (CAPEX) | USD 1 billion |
| Technology Focus | Advanced semiconductor packaging (QFN/LFBGA, Hybrid Bonding) |
| Rbm Infracon Equity Stake | 30% |
| SUJOK Global Equity Stake | 70% (Including USD 600 million FDI) |
| Execution Timeline | Within 90 days (Subject to due diligence and regulatory approvals) |
The realization of the facility remains subject to satisfactory completion of due diligence, receipt of all necessary regulatory approvals, and the execution of definitive agreements within the next 90 days.
RBMINFRA Stock Price Movement
On Friday, shares of Rbm Infracon Limited slipped by 4.44% to settle at ₹399.05. The stock recorded a total traded volume of 48,200 shares, marking a notable decline from its opening price.Source:
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