<h1>Paras Defence Subsidiary to Invest Rs 6,200 Crores in Greenfield Advanced IC Packaging Facility in Madhya Pradesh</h1>
Paras Semiconductors Private Limited, a subsidiary of Paras Defence and Space Technologies Limited, has signed a Memorandum of Understanding (MoU) with the Department of Science and Technology, represented by MP State Electronics Development Corporation (MPSeDC). This partnership aims to establish a greenfield advanced IC packaging Outsourced Semiconductor Assembly and Test (OSAT) facility in Madhya Pradesh.
The collaboration between Paras Semiconductors and MPSeDC will integrate their respective expertise and resources to facilitate the establishment of the sophisticated manufacturing base.
Paras Semiconductors plans to set up this advanced IC packaging OSAT facility in Indore-Ujjain, Madhya Pradesh. The project involves a proposed investment amounting to approximately Rs 6,200 Crores.
The new facility will conduct comprehensive advanced packaging operations. These activities include 3D heterogeneous integration, 2.5D/3D advanced packaging, hybrid bonding, ultra high density fan-out packaging, chiplet integration, wafer bumping, flip-chip assembly, testing, and reliability checks.
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