Mold-Tek Packaging Ltd to Hold Board Meeting to Consider First Interim Dividend for FY 2025-26

Mold-Tek Packaging Ltd to Hold Board Meeting to Consider First Interim Dividend for FY 2025-26

Mold-Tek Packaging Ltd to Hold Board Meeting to Consider First Interim Dividend for FY 2025-26​

Mold-Tek Packaging Ltd announced that a meeting of its Board of Directors is scheduled for Monday, April 20, 2026. The primary purpose of the meeting is to consider the declaration of the First Interim Dividend for the Financial Year 2025-26.

The company also announced the specific record date for identifying eligible shareholders for the dividend.

Event DetailDatePurpose
Board MeetingMonday, April 20, 2026To consider declaration of First Interim Dividend for the Financial Year 2025-26.
Record DateFriday, April 24, 2026For determining the eligibility of members for payment of interim dividend, if declared.

In addition to the dividend considerations, Mold-Tek Packaging Ltd provided an operational update regarding its trading window. The company had closed its trading window effective from April 01, 2026, and the window will remain closed until the end of 48 hours following the declaration of the audited Financial Results for the quarter and year ended on March 31, 2026.

MOLDTKPAC Stock Price Movement​

On Wednesday, Mold-Tek Packaging Limited shares edged higher, concluding the session at ₹541.50 after gaining 1.84%. The equity saw a total volume of 144,208 shares traded, with the price charting a movement between ₹532 and ₹545.

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