HP Adhesives Ltd Board Approves Rs 21.6 Million Working Capital Term Loan from ICICI Bank
HP Adhesives Ltd has secured a significant financial agreement following its Board meeting held on July 13, 2026. The Board of Directors considered and approved the terms for availing a Working Capital Term Loan (ECLGS) totaling Rs 21.6 million.The financing is provided by ICICI Bank Limited. Under the approved terms, the loan features an interest rate of 9% per annum and offers a total tenure of five years. A key element of the agreement includes a one-year moratorium on principal payments.
The decision was ratified during the Board meeting which commenced at 04:00 p.m. and concluded at 04:30 p.m. The facility will aid the company in its working capital requirements.
HPAL Stock Price Movement
Shares of HP Adhesives Limited slipped by 1.18% in post-market trading today, settling at ₹34.45. The equity traded a volume of 39,336 shares during the session.Disclaimer: Due care and diligence have been taken in compiling and presenting news and market-related content. However, errors or omissions may arise despite such efforts.
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